Amkor Technology Boosts U.S. Advanced Packaging Operations with New Arizona Land

May 20, 2026 - 05:59

TEMPE, Ariz. -- Amkor Technology has acquired additional land in Arizona to expand its advanced packaging capabilities in the United States. The move signals a continued push to strengthen domestic semiconductor supply chains and meet growing demand for high-performance chip packaging.

The company, which already operates a major facility in the state, said the new site will allow it to scale production of advanced packaging technologies used in artificial intelligence, automotive, and high-performance computing applications. Advanced packaging is a critical step in chip manufacturing, where multiple components are integrated into a single package to improve performance and efficiency.

Amkor's expansion comes as the U.S. government pushes to reduce reliance on overseas manufacturing for key semiconductor technologies. The company did not disclose the exact size of the land parcel or the financial terms of the acquisition, but noted that construction planning is already underway.

The new facility is expected to create hundreds of skilled jobs in the region and further cement Arizona's role as a hub for semiconductor manufacturing. Amkor joins a growing list of chip companies expanding operations in the state, including Intel and TSMC, which are also investing billions in new fabrication plants.

Industry analysts view the expansion as a positive sign for U.S. efforts to build a more resilient semiconductor ecosystem. Advanced packaging is seen as a bottleneck in the supply chain, and domestic capacity has lagged behind demand for years. With this new land acquisition, Amkor is positioning itself to capture a larger share of that market while supporting the broader reshoring trend in electronics manufacturing.